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Plasma Cleaning Equipment - List of Manufacturers, Suppliers, Companies and Products

Plasma Cleaning Equipment Product List

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Plasma cleaning device "POEM" (plasma cleaner)

Multi-functional plasma cleaning device. Sample testing currently accepted. Suitable for cleaning and hydrophilization, improving solder wettability, and optimal for pre-treatment before mounting.

Simplifying and reducing the cost of semiconductor manufacturing equipment chambers for application in plasma cleaning. Achieving unprecedented surface treatment through plasma mode switching mechanisms (RIE, DP) and multi-gas (Ar, N2, O2, H2) processes. Substrate cleaning (removal of oxides, organic materials, and fine foreign substances). Hydrophilic treatment (pre-treatment for plating, improving solder wettability). Hydrophobic treatment (pre-treatment before wet processes). Proven results in reflow pre-treatment with significant improvements in solder wettability. Extensive track record in mass production lines for high-end products (high-density mounting substrates, flexible substrates, power device modules). Inline and sheet-type options are available in the standard lineup to match substrate and line configurations.

  • Other mounting machines

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DLC De-coating Device (Plasma Cleaner for Precision Molds)

A plasma cleaning device with extensive experience in removing DLC films from aspherical lenses. An essential dry film removal device for the repair of high-value-added molds.

Upgraded and customized the highly experienced plasma cleaning device "POEM" for DLC film removal. Improved the energy of ions during processing compared to conventional types, enabling the removal of dense DLC films. Proven results not only in the standard O2 cleaning process but also in the multi-gas process for the removal of various customized DLC films, including Si-containing DLC. Naturally, it also supports the removal of molding residues and oxidation layers on mold surfaces, as well as cleaning before plating. Provides proven processes for cleaning and surface treatment before and after mold specifications.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment

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Plasma cleaner device "SPE-2136A"

Simultaneous processing of two wafers for high throughput. Contributes to reducing wafer transfer costs.

The SPE-2136A is a plasma cleaner device capable of residue removal, surface modification, and ashing treatment for wafers ranging from φ4 to φ6 inches. It comes with an automatic transport mechanism, which helps prevent wafer breakage and reduces labor costs and working time associated with wafer transfer. The process chamber can handle two wafers simultaneously, achieving high throughput. 【Features】 ■ Compact design measuring 1400(W) × 3000(D) × 1900(H) mm ■ Distribution within the wafer is ±5% or less ■ Compatible with ultra-thin piezoelectric wafers such as SAW devices ■ Ar plasma cleaning is also available as an option *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

  • Plasma surface treatment equipment
  • others

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